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Title:
SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND MODULE DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/010021
Kind Code:
A1
Abstract:
The present invention improves thermal conductivity. This invention is provided with a base body including: a first surface; and a second surface located on the opposite side as the first surface. The base body has at least one recess provided in the first surface. The interior of the recess is filled with a metal member having a thermal conductivity higher than the thermal conductivity of the base body. In a cross-section cut in a first direction orthogonal to the first surface and to the second surface, the width of the recess in a direction parallel to the first surface decreases as the distance from the surface, of the first surface or the second surface, where the recess is provided, increases.

Inventors:
SUGAI KOUICHIROU (JP)
SHIMADA KYOTA (JP)
Application Number:
PCT/JP2023/024867
Publication Date:
January 11, 2024
Filing Date:
July 05, 2023
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/12; H01L23/36
Foreign References:
JPH10335571A1998-12-18
JPH0736468U1995-07-04
JP2022015483A2022-01-21
US20070284711A12007-12-13
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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