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Title:
SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND MODULE DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/010022
Kind Code:
A1
Abstract:
The present invention improves heat conductivity. The present invention comprises: a base body having a first surface, a second surface located on the opposite side of the first surface, at least one first recess that opens in the first surface, and at least one second recess that opens in the second surface; a first metal member located inside the first recess; and a second metal member located inside the second recess, wherein the heat conductivity of the first metal member and the heat conductivity of the second metal member are higher than the heat conductivity of the base body.

Inventors:
SUGAI KOUICHIROU (JP)
SHIMADA KYOTA (JP)
Application Number:
PCT/JP2023/024868
Publication Date:
January 11, 2024
Filing Date:
July 05, 2023
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/12; H01L23/36
Foreign References:
JPH10335571A1998-12-18
JPH0736468U1995-07-04
JP2022015483A2022-01-21
US20070284711A12007-12-13
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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