Title:
SUBSTRATE HEAT TREATMENT APPARATUS AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/045818
Kind Code:
A1
Abstract:
A substrate heat treatment apparatus, comprising a fixing frame; a movable base for loading a heat treatment module; a limited plate-like motion guide rail, the movable base being movably mounted in the fixing frame by means of the limited plate-like motion guide rail; a first positioning pin assembly for positioning and fixing the movable base in the motion direction of the movable base; at least two sets of sliding assemblies distributed on two sides of the movable base in a horizontal direction perpendicular to the motion direction, each set of sliding assembly comprising a guide wheel and a sliding rail which cooperate with each other, and a positioning wheel and a positioning sliding rail being used as the guide wheel and the sliding rail of at least one set of sliding assembly for positioning the movable base in the horizontal direction perpendicular to the motion direction of the movable base. The present invention further provides a semiconductor device, comprising at least one standby substrate heat treatment apparatus.
Inventors:
CHENG CHENG (CN)
WANG HUI (CN)
WU JUN (CN)
WU LEI (CN)
CHEN TIANZHE (CN)
XU FEI (CN)
WANG HUI (CN)
WU JUN (CN)
WU LEI (CN)
CHEN TIANZHE (CN)
XU FEI (CN)
Application Number:
PCT/CN2023/102586
Publication Date:
March 07, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/67; H01L21/324
Foreign References:
| KR101760706B1 | 2017-07-26 | |||
| CN106263511A | 2017-01-04 | |||
| CN210095565U | 2020-02-21 | |||
| CN202625261U | 2012-12-26 | |||
| JP2000058408A | 2000-02-25 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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