Title:
SUBSTRATE JOINING DEVICE AND SUBSTRATE JOINING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/020781
Kind Code:
A1
Abstract:
Provided is a substrate joining device (100), which joins a first substrate (11) comprising at least one among a semiconductor material, a compound semiconductor material, and a metal material, with a second substrate (12), the substrate joining device (100) being provided with: a lower stage (113) for holding the first substrate (11); an upper stage (115) for holding the second substrate (12); a lifting cylinder (114) for vertically moving the upper stage (115); an exhaust pump (116) for evacuating a chamber (111); a gas source (117) for supplying a gas (1) such as Ar into the chamber (111); electrode plates (113a, 115a) and an alternating current power source (118) which generate plasma (2) of the gas (1) between the upper and lower stages (113, 115); and an earth (119) which causes plasma particles (Mp) to collide with the surface of the first substrate (11) and sputtered particles (Ms) from the first substrate (11) to be attached to the surface of the second substrate (12).
Inventors:
UTSUMI JUN (JP)
IDE KENSUKE (JP)
SUZUKI TAKENORI (JP)
GOTO TAKAYUKI (JP)
IDE KENSUKE (JP)
SUZUKI TAKENORI (JP)
GOTO TAKAYUKI (JP)
Application Number:
PCT/JP2017/018187
Publication Date:
February 01, 2018
Filing Date:
May 15, 2017
Export Citation:
Assignee:
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD (JP)
International Classes:
H01L21/02; B23K20/00; H01L21/3065
Foreign References:
| JP2014107393A | 2014-06-09 | |||
| JP2004273941A | 2004-09-30 |
Attorney, Agent or Firm:
MITSUISHI, Toshiro et al. (JP)
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