Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176338
Kind Code:
A1
Abstract:
A substrate processing device (100) comprising: a chamber (112); a substrate holding part (120) for holding and rotating a substrate (W) in the chamber (112); a treatment liquid supplying part (130) for supplying a treatment liquid to the top surface (Wt) of the substrate (W); a near infrared light source (140) for irradiating the inside of the chamber (112) with near infrared rays; a near infrared imaging unit (150) that generates a captured image of the treatment liquid in the chamber (112) irradiated with the near infrared rays from the near infrared light source (140); and a control unit (102) that identifies an outer edge of the treatment liquid in the chamber (112) on the basis of the captured image.
Inventors:
SHIMIZU SHINJI (JP)
Application Number:
PCT/JP2023/006359
Publication Date:
September 21, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Domestic Patent References:
| WO2021091636A1 | 2021-05-14 |
Foreign References:
| JP2021044417A | 2021-03-18 | |||
| JP2021044467A | 2021-03-18 | |||
| JP2020061417A | 2020-04-16 | |||
| JP2009279476A | 2009-12-03 | |||
| JP2020061403A | 2020-04-16 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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