Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/057951
Kind Code:
A1
Abstract:
This substrate processing apparatus comprises: a substrate holding unit that holds a substrate; a drive mechanism that drives a tool for processing the substrate being held by the substrate holding unit; a housing in which the substrate holding unit and the tool are housed; and a sprayer that sprays a mist of liquid into the housing.
Inventors:
KODAMA MUNEHISA (JP)
WAKAMATSU TAKAYOSHI (JP)
WAKAMATSU TAKAYOSHI (JP)
Application Number:
PCT/JP2023/031783
Publication Date:
March 21, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B55/06; B23Q11/00; B24B7/04; H01L21/304
Foreign References:
| JP2016055408A | 2016-04-21 | |||
| JP2022084452A | 2022-06-07 | |||
| JP2014111301A | 2014-06-19 | |||
| JPS6451252A | 1989-02-27 | |||
| JP2002198340A | 2002-07-12 | |||
| JP2009117794A | 2009-05-28 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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