SUBSTRATE PROCESSING DEVICE AND INFORMATION PROCESSING SYSTEM

WIPO Patent Application WO/2022/264753

A1

An information processing system comprising: at least one sensor for detecting a physical quantity of interest during polishing and/or cleaning and/or drying of a substrate; a conversion section for converting, with respect to a trained machine learning model, a sensor value detected during polishing and/or cleaning and/or drying by the sensor into a feature quantity for each processing step; and an inference section which, by inputting object data including the feature quantity into the trained machine learning model, outputs a predicted value of at least one of the number of defects in the substrate of interest, defect size, and defect position. The trained machine learning model is trained using a learning data set of input data and output data, the input data including a feature quantity obtained by converting, for each processing step, a sensor value detected during polishing and/or cleaning by a sensor in a production line of interest or in a production line of the same type as the production line of interest, the output data including at least one of the number of defects in the substrate, defect size, and defect position.

SUZUKI YUTA (JP)
TAKAHASHI HIROKI (JP)
NAKAMURA AKIRA (JP)
WATANABE KATSUHIDE (JP)
MATSUO HISANORI (JP)
KAGOSHIMA TAKAHITO (JP)

PCT/JP2022/021203

December 22, 2022

May 24, 2022

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EBARA CORP (JP)

H01L21/304; G06N20/00; H01L21/00

JP2020013918A	2020-01-23
JP2020150155A	2020-09-17
JP2020127041A	2020-08-20
JP2012256800A	2012-12-27
JP2013084746A	2013-05-09
JP2020053550A	2020-04-02

OHNO Seiji et al. (JP)

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