SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2021/053885

A1

The present invention pertains to a substrate processing device and a substrate processing method. The substrate processing device 1 comprises a processing unit 14 and a control unit 18. The processing unit 14 comprises a substrate-holding part 31, a rotation drive unit 35, a processing fluid supply unit 41, a fluid recovery unit 50, and a guard drive unit 60. The substrate-holding part 31 holds a substrate W in a horizontal posture. The rotation drive unit 35 rotates the substrate-holding part 31. The fluid recovery unit 50 includes a first guard 51, a second guard 52, and a fluid introduction opening 58. The first guard 51 and the second guard 52 are positioned so as to surround the sides of the substrate-holding part 31. The fluid introduction opening 58 is demarcated by the guards. The fluid introduction opening 58 is opened to the substrate W held by the substrate-holding part 31. The guard drive unit 60 moves the second guard 52 in the vertical direction. The control unit 18 controls the guard drive unit 60 in accordance with the shape of the substrate W held by the substrate-holding part 31, and changes the height position of the upper end 58T of the fluid introduction opening 58.

HINODE TAIKI (JP)
OTA TAKASHI (JP)
TAKAHASHI MITSUKAZU (JP)
HONSHO KAZUHIRO (JP)
AKIZUKI YUSUKE (JP)

PCT/JP2020/020548

March 25, 2021

May 25, 2020

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304

JP2009110985A	2009-05-21
JP2006286833A	2006-10-19
JP2006060252A	2006-03-02
JPH1187294A	1999-03-30

SUGITANI Tsutomu (JP)

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