Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/042487
Kind Code:
A1
Abstract:
Provided is a technology capable of reducing contamination caused by processing fluid that has been heat affected by plasma processing. A substrate processing device (132) comprises: a holding unit (1) that holds a substrate (W); a processing fluid supply unit that supplies processing fluid to the substrate (W) held by the holding unit (1); a plasma irradiation unit (31) that irradiates plasma onto the substrate (W) held by the holding unit (1); a movement mechanism (33) that moves plasma irradiation unit (31) between a standby position at which the substrate (W) held by the holding unit (1) is not irradiated with plasma and a plasma processing position at which plasma is irradiated onto the substrate (W) held by the holding unit (1); and a gas flow formation unit (4) that forms a gas flow that follows a facing surface (310) that faces the substrate (W) in the plasma irradiation unit (31).
Inventors:
NAMBA TOSHIMITSU (JP)
Application Number:
PCT/JP2022/020978
Publication Date:
March 23, 2023
Filing Date:
May 20, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2021125283A | 2021-08-30 | |||
| JP2002534797A | 2002-10-15 | |||
| KR20210084729A | 2021-07-08 | |||
| JPS57192954A | 1982-11-27 | |||
| JP2012182371A | 2012-09-20 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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