Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/228776
Kind Code:
A1
Abstract:
This substrate processing device comprises: a substrate holding unit that holds a substrate horizontally; a first processing liquid supply unit that supplies a first processing liquid to the surface of the substrate held by the substrate holding unit; a second processing liquid supply unit that supplies a second processing liquid replacing the first processing liquid on the surface of the substrate held by the substrate holding unit; and a potentiometer that measures the electric potential at the outer periphery of the surface of the substrate held by the substrate holding unit.
Inventors:
TAKEGUCHI HIROFUMI (JP)
NAKASHOYA TAKAHITO (JP)
KOSAI KAZUKI (JP)
SHINOHARA KAZUYOSHI (JP)
NAKASHOYA TAKAHITO (JP)
KOSAI KAZUKI (JP)
SHINOHARA KAZUYOSHI (JP)
Application Number:
PCT/JP2023/017891
Publication Date:
November 30, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2019046869A | 2019-03-22 | |||
| JP2011222886A | 2011-11-04 | |||
| JP2010140966A | 2010-06-24 | |||
| JP2004186633A | 2004-07-02 | |||
| JP2014194965A | 2014-10-09 | |||
| JP2008016660A | 2008-01-24 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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