Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/024544
Kind Code:
A1
Abstract:
A substrate processing device according to one aspect of the present disclosure comprises: a processing container which accommodates a plurality of substrates arranged in multiple stages; a processing gas supply pipe which extends in the arrangement direction of the plurality of substrates and supplies a processing gas into the processing container; and a pair of inert gas supply pipes which are provided at positions that sandwich the processing gas supply pipe in the circumferential direction of the substrates, extend in the arrangement direction, and supply an inert gas into the processing container, wherein the pair of inert gas supply pipes are configured to spray the inert gas toward the inner surface of the side wall of the processing container.
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Inventors:
TAKAHASHI KAZUYA (JP)
SAKASHITA KUNIYASU (JP)
ENDO ATSUSHI (JP)
KOJIMA JUNYA (JP)
SAKASHITA KUNIYASU (JP)
ENDO ATSUSHI (JP)
KOJIMA JUNYA (JP)
Application Number:
PCT/JP2023/026053
Publication Date:
February 01, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/455
Foreign References:
| JP2021150410A | 2021-09-27 | |||
| JP2019186335A | 2019-10-24 | |||
| JP2009500864A | 2009-01-08 | |||
| JPS6447018A | 1989-02-21 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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