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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/048983
Kind Code:
A1
Abstract:
[Problem] To provide a substrate processing device capable of minimizing variations in the flow speed of a liquid. [Solution] A substrate processing device according to the present embodiment comprises a processing tank which can store a liquid. A plurality of semiconductor substrates are arranged on a conveyance unit such that the surfaces of said plurality of semiconductor substrates face a substantially horizontal direction, and the conveyance unit can convey the plurality of semiconductor substrates into the processing tank. A plurality of liquid supply units can supply a liquid from below the processing tank toward the inner side of the processing tank. A plurality of flow-regulating plates are positioned at one end side and/or the other end side of the arrangement of the plurality of semiconductor substrates. The plurality of flow-regulating plates are provided in a first gap region above the semiconductor substrates, among gaps between the conveyance unit and the side walls of the processing tank at both sides of the conveyance unit, when viewed from the arrangement direction of the plurality of semiconductor substrates.

Inventors:
KINOSHITA SHIGERU (JP)
MATSUMOTO SHUSAKU (JP)
KAWANO KOICHIRO (JP)
FUJITA HIROSHI (JP)
KITAMURA YOSHINORI (JP)
Application Number:
PCT/JP2019/035965
Publication Date:
March 18, 2021
Filing Date:
September 12, 2019
Export Citation:
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Assignee:
KIOXIA CORP (JP)
International Classes:
H01L21/306
Foreign References:
JP2017195338A2017-10-26
JP2009238802A2009-10-15
JPH07161677A1995-06-23
JPH0722371A1995-01-24
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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