Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/090098
Kind Code:
A1
Abstract:
The present invention provides a substrate processing device 1, wherein an indexer block B1, a polishing block B2, an application block B3, and an interface block B5 are linearly arranged in this order in the horizontal direction. The application block B3 has an application unit PR for applying a resist onto the front surface of a substrate W. The polishing block B2 has a polishing unit 22 for polishing the back surface of the substrate W. The polishing unit 22 is provided with: a holding/rotation unit for rotating, with the substrate W held in a horizontal attitude, the substrate; a heating means for heating the substrate W; and, a polishing tool, which includes a resin body in which abrasive grains are dispersed, for contacting the back surface of the substrate W, which rotates while being heated, to polish the back surface of the substrate W by a chemomechanical grinding method.
Inventors:
ISHII HIROAKI (JP)
ISHII JUNICHI (JP)
ISHII JUNICHI (JP)
Application Number:
PCT/JP2022/039935
Publication Date:
May 25, 2023
Filing Date:
October 26, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/027
Foreign References:
| JP2018050051A | 2018-03-29 | |||
| JP2021003795A | 2021-01-14 | |||
| JPH0778796A | 1995-03-20 | |||
| JPS6176260A | 1986-04-18 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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