Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/111911
Kind Code:
A1
Abstract:
A substrate processing method according to the present invention comprises: formation of a carbon-containing base film on the surface of a substrate; and formation of a coating film on the base film by supplying a resist liquid, which is photosensitive to EUV light, to the surface of the substrate.
Inventors:
OKADA SOICHIRO (JP)
YOSHIDA KEISUKE (JP)
YOSHIDA KEISUKE (JP)
Application Number:
PCT/JP2020/043469
Publication Date:
June 10, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/09; G03F7/16; G03F7/30; G03F7/38; H01L21/027; H01L21/205
Domestic Patent References:
| WO2013133088A1 | 2013-09-12 |
Foreign References:
| JPH0635206A | 1994-02-10 | |||
| JP2003209046A | 2003-07-25 | |||
| JP2008210930A | 2008-09-11 | |||
| JP2003027237A | 2003-01-29 | |||
| JPH08172039A | 1996-07-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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