Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/162341
Kind Code:
A1
Abstract:
According to the present invention, in a processing liquid feeding step for generating an up-flow of a processing liquid in a processing tank in a state where a substrate is present in the processing tank, the substrate is held at an upper position in the processing tank. On the other hand, in an immersion processing step for immersing the substrate in a warm processing liquid stored in the processing tank, the substrate is held at a lower position in the processing tank. When immersing the substrate in the warm processing liquid, a liquid depth which is the distance from the liquid surface of the processing liquid to the substrate is increased by lowering the holding position of the substrate. Thus, even if the liquid surface level of the warm processing liquid has decreased to some extent due to evaporation of water during immersion processing, it is possible to prevent, with certainty, the substrate from being exposed out of the processing liquid.
Inventors:
KISHIDA TAKUYA (JP)
UCHIDA HIROAKI (JP)
FUJII DAIKI (JP)
NAKANO HARUMASA (JP)
UCHIDA HIROAKI (JP)
FUJII DAIKI (JP)
NAKANO HARUMASA (JP)
Application Number:
PCT/JP2022/040510
Publication Date:
August 31, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| WO2019054083A1 | 2019-03-21 |
Foreign References:
| JP2006332425A | 2006-12-07 | |||
| JP2013069979A | 2013-04-18 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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