Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/189072
Kind Code:
A1
Abstract:
A substrate processing method comprising: a step (step S11) in which a substrate is rotated around a vertically oriented central shaft; a step (step S13) in which a gas is supplied to the center of a substrate main surface being either the upper surface or the lower surface, during rotation, and a rinse fluid is supplied at a first flow rate to the center of the other main surface of the substrate and caused to swirl around the peripheral area of the first main surface, thereby forming a gas/liquid boundary between the gas and the rinse fluid on the first main surface; and a step (step S15) in which a chemical liquid is supplied to the center of the other main surface of the substrate and caused to swirl around the peripheral area of the first main surface, during rotation, at a time after step 13 and at a second flow rate lower than the first flow rate, thereby supplying chemical fluid chemical fluid as far as the gas/liquid boundary surface on the first main surface and performing chemical fluid treatment on the peripheral area. As a result, chemical treatment of the peripheral area of the substrate can be suitably performed while suppressing splashing of the chemical fluid.
Inventors:
MIURA ATSUYASU (JP)
EDO TORU (JP)
EDO TORU (JP)
Application Number:
PCT/JP2020/004588
Publication Date:
September 24, 2020
Filing Date:
February 06, 2020
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2009266951A | 2009-11-12 | |||
| JP2003273063A | 2003-09-26 | |||
| JP2012064894A | 2012-03-29 |
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
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