Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205994
Kind Code:
A1
Abstract:
This substrate processing method has the following (A) to (C). (A) In a state in which a substrate is horizontally held and rotated, an acidic or alkaline first chemical and pure water are supplied in this order to a lower surface of the substrate from a nozzle unit including a plurality of nozzles that are disposed facing the center of the lower surface of the substrate. (B) The substrate is horizontally held and rotated, and is dried. (C) After the first chemical is supplied, pure water is discharged from one of the nozzles of the nozzle unit before drying the substrate, and a pure water cleaning film covering all the nozzles of the nozzle unit is formed on the nozzle unit.
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Inventors:
YAMAMOTO RYO (JP)
FUJIMOTO SEIYA (JP)
MIZUNO TSUYOSHI (JP)
TAKEGUCHI HIROFUMI (JP)
YABUTA TAKASHI (JP)
YAMASHITA ATSUSHI (JP)
IKEDA YOSHINORI (JP)
OKAMOTO EIICHIRO (JP)
SOTOME RYOTA (JP)
FUJIMOTO SEIYA (JP)
MIZUNO TSUYOSHI (JP)
TAKEGUCHI HIROFUMI (JP)
YABUTA TAKASHI (JP)
YAMASHITA ATSUSHI (JP)
IKEDA YOSHINORI (JP)
OKAMOTO EIICHIRO (JP)
SOTOME RYOTA (JP)
Application Number:
PCT/JP2021/014232
Publication Date:
October 14, 2021
Filing Date:
April 01, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2018056223A | 2018-04-05 | |||
| JP2018093146A | 2018-06-14 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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