SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING APPARATUS

WIPO Patent Application WO/2021/145175

A1

The purpose of the present invention is to provide a substrate processing method whereby the result of performing a solution process can easily be made to approach a target process result.　This substrate processing method comprises: adjusting at least one parameter obtained by establishing, among reference conditions, a condition of a solution process in a stage before a substrate starts rotating at a second rotation speed in a drying process, said at least one parameter being adjusted on the basis of a predetermined target thickness distribution of a coating film and on the basis of the thickness distribution of the coating film obtained by executing the solution process in accordance with the prescribed reference conditions, the solution process including an application process that includes discharging a processing solution toward the surface of the substrate while the substrate is caused to rotate at a first rotation speed, and the drying process that includes causing the substrate to rotate at the second rotation speed after the application process so as to dry the coating film of the processing solution on the surface of the substrate; and performing the solution process on the substrate in accordance with control conditions obtained by adjusting the at least one parameter from among the reference conditions.

NAKAMURA JUNJI (JP)
TERADA SHOICHI (JP)

PCT/JP2020/048136

July 22, 2021

December 23, 2020

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TOKYO ELECTRON LTD (JP)

B05C9/12; B05C11/08; B05D1/40; B05D3/00; G03F7/26; G03F7/30; H01L21/027

JP2016147246A	2016-08-18
JP2008177410A	2008-07-31
JP2005279628A	2005-10-13
JPH1092726A	1998-04-10
JPH11121367A	1999-04-30
JP2000124120A	2000-04-28
JP2000237669A	2000-09-05

HASEGAWA Yoshiki et al. (JP)

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