Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/070833
Kind Code:
A1
Abstract:
Provided is a technique for adjusting the exposure sensitivity of a resist film. A substrate processing method is provided. This method is a substrate processing method comprising: (a) a step for providing a substrate having a base film; (b) a step for forming a first film on the base film, the first film being made of a material including an element with a larger extreme ultra violet (EUV) absorption cross-sectional area than the base film; and (c) a step for forming a second film on the first film, the second film being a metal-containing resist film.
Inventors:
KUMAKURA SHO (JP)
ONO KENTA (JP)
NAKANE YUTA (JP)
NISHIZUKA TETSUYA (JP)
HONDA MASANOBU (JP)
ONO KENTA (JP)
NAKANE YUTA (JP)
NISHIZUKA TETSUYA (JP)
HONDA MASANOBU (JP)
Application Number:
PCT/JP2023/034011
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; H01L21/3065
Attorney, Agent or Firm:
SATO, Atsushi et al. (JP)
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