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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/070834
Kind Code:
A1
Abstract:
The present invention provides a technology for adjusting the exposure sensitivity of a resist film.　The present invention provides a substrate processing method. This method comprises (a) a step (ST1) for providing a substrate that has a base film, and (b) a step (ST2) for forming a metal-containing resist film on the base film. The (b) step comprises (b1) a step (ST21) for forming a first resist film, which contains a metal, on the base film, and (b2) a step (ST22) for forming a second resist film, which contains a metal at a composition ratio that is different from the composition ratio of the fist resist film, on the first resist film.

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Inventors:
KUMAKURA SHO (JP)
ONO KENTA (JP)
NAKANE YUTA (JP)
NISHIZUKA TETSUYA (JP)
HONDA MASANOBU (JP)
Application Number:
PCT/JP2023/034013
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/18; C23C16/455; H01L21/027
Domestic Patent References:
WO2022016123A12022-01-20
WO2020129616A12020-06-25
Foreign References:
JP2022539721A2022-09-13
JP2020013823A2020-01-23
Attorney, Agent or Firm:
SATO, Atsushi et al. (JP)
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