Title:
SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/090171
Kind Code:
A1
Abstract:
In this substrate processing method, a water-repellent treatment is performed on a top surface of a substrate so as to change the contact angle of purified water with respect to a flat surface to 90° or greater, and then a hydrophobic liquid is supplied to the top surface of the substrate, thereby replacing a water repellent-containing liquid on the top surface of the substrate with the hydrophobic liquid (hydrophobic liquid replacement step). After the hydrophobic liquid replacement step, a hydrophilic liquid is supplied to the top surface of the substrate, thereby replacing the hydrophobic liquid on the top surface of the substrate with the hydrophilic liquid (hydrophilic liquid replacement step). After the hydrophilic liquid replacement step, the hydrophilic liquid on the top surface of the substrate is allowed to flow and is removed from the top surface of the substrate, and the top surface of the substrate is thereby dried (drying step).
Inventors:
TANAKA TAKAYOSHI (JP)
OTSUJI MASAYUKI (JP)
OTSUJI MASAYUKI (JP)
Application Number:
PCT/JP2022/041193
Publication Date:
May 25, 2023
Filing Date:
November 04, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2013214724A | 2013-10-17 | |||
| JP2013157480A | 2013-08-15 | |||
| JP2021141086A | 2021-09-16 | |||
| JP2003297827A | 2003-10-17 | |||
| JPH08306087A | 1996-11-22 | |||
| JP2011124410A | 2011-06-23 | |||
| JP2010114414A | 2010-05-20 | |||
| JP2016195230A | 2016-11-17 | |||
| JP2017038029A | 2017-02-16 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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