Title:
SUBSTRATE PRODUCTION SIMULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/113254
Kind Code:
A1
Abstract:
This substrate production simulation method simulates the production of product substrates for which component mounting has been completed by using a substrate production line including a mounting line in which a plurality of part mounting machines for mounting, on the substrates, parts supplied from a part supply device are arranged. This method includes steps (a) to (c). In the step (a), a first result is obtained by simulating on the premise that the provision and collection of a component supply device to and from a substrate production line are performed without delay. In the step (b), a second result is obtained by simulating on the premise that the provision and/or collection of the component supply device to and from the substrate production line is performed by automation equipment and/or the operator. In the step (c), the first result and the second result are output to the same screen in a form showing the transition of the number of product substrates produced over time.
More Like This:
| JPS58216834 | TRAY LOADER |
| JPS5276678 | DEVICE FOR MOUNTING ELECTRONIC PARTS |
| JPS5263095 | PRESS-IN TYPE HERMETIC SEAL |
Inventors:
MORITA YUKITOSHI (JP)
Application Number:
PCT/JP2020/044163
Publication Date:
June 02, 2022
Filing Date:
November 27, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00
Foreign References:
| JPH11232339A | 1999-08-27 | |||
| JP2004070574A | 2004-03-04 | |||
| JP2005100092A | 2005-04-14 |
Other References:
See also references of EP 4255143A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Download PDF:
Previous Patent: DISPLAY SYSTEM AND DISPLAY METHOD
Next Patent: SUBSTRATE PRODUCTION SIMULATION METHOD
Next Patent: SUBSTRATE PRODUCTION SIMULATION METHOD