Title:
SUBSTRATE PRODUCTION SIMULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/113255
Kind Code:
A1
Abstract:
In this substrate production simulation method, production of a product substrate with mounting of components completed is simulated using a substrate production line that includes a mounting line in which are aligned a plurality of component mounting machines that mount components supplied from a component supply device. This method includes steps (a) to (c). In step (a), simulation is done with a premise of provision and/or collection of a component supply device to a substrate production line being performed without delay, and a first result is obtained. In step (b), simulation is done with a premise of provision and/or collection of the component supply device to the substrate production line being performed by automation equipment and/or a worker, and a second result is obtained. In step (c), the production delay of the second result with respect to the first result, and parameters that can be a cause of the production delay included in the second result are outputted on the same screen.
Inventors:
HOTTA MIKI (JP)
Application Number:
PCT/JP2020/044164
Publication Date:
June 02, 2022
Filing Date:
November 27, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00
Domestic Patent References:
| WO2018109856A1 | 2018-06-21 |
Foreign References:
| JPH11232339A | 1999-08-27 | |||
| JP6526808B2 | 2019-06-05 | |||
| JPH09138820A | 1997-05-27 | |||
| JPH08314526A | 1996-11-29 | |||
| JP3720289B2 | 2005-11-24 | |||
| JP2005100092A | 2005-04-14 | |||
| JP2020013388A | 2020-01-23 |
Other References:
See also references of EP 4255144A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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