Title:
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2023/182351
Kind Code:
A1
Abstract:
This substrate treatment device (100) comprises a substrate holding part (13) and a coating member (151). The substrate holding part (13) causes a substrate (W) to rotate while holding the substrate (W). The coating member (151), by coming into contact with an end surface part (51) located on the outer side in a radial direction (RD) of the substrate (W) being rotated, coats the end surface part (51) of the substrate (W) with a repellent which contains a liquid-repelling substance capable of repelling a treatment liquid for treating the substrate (W).
Inventors:
LIN TSUNG JU (JP)
IWASAKI AKIHISA (JP)
TANAKA TAKAYOSHI (JP)
IWASAKI AKIHISA (JP)
TANAKA TAKAYOSHI (JP)
Application Number:
PCT/JP2023/011202
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
JP2020155496A | 2020-09-24 | |||
JP2020155756A | 2020-09-24 | |||
JPH0992646A | 1997-04-04 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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