SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD

WIPO Patent Application WO/2023/243409

A1

This substrate treatment device removes an object to be removed from a substrate using a treatment solution. The substrate treatment device comprises: a holding unit that holds the substrate; a solution supply unit that supplies treatment solution to the substrate that is held by the holding unit; an electrode that is disposed so as not to be in contact with the substrate that is held by the holding unit, and makes contact with the treatment solution that is supplied from the solution supply unit; an electric power source that applies a voltage to the electrode; and a control unit that controls the solution supply unit and the electric power source. The control unit generates OH radicals in the treatment solution that is supplied from the solution supply unit, by applying a voltage to the electrode with the electrode and the substrate in contact with the treatment solution, and provides the OH radicals to the object to be removed.

JP2003197603	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLIANCE AND METHOD FOR MANUFACTURING THE SAME
JP3376258	INDUSTRIAL APPLICABILITY: Anodization apparatus and an apparatus and method related thereto.
WO/2013/025097	METHOD AND SYSTEM FOR FORMING A METALLIC STRUCTURE

HIGUCHI RINTARO (JP)
NAKAMORI MITSUNORI (JP)
KANNO ITARU (JP)

PCT/JP2023/020290

December 21, 2023

May 31, 2023

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TOKYO ELECTRON LTD (JP)

H01L21/3063; C25F3/02; C25F3/04; C25F3/06; C25F3/08; H01L21/304; H01L21/306

WO2015125739A1

2015-08-27

JP2006013143A	2006-01-12
JP2004342841A	2004-12-02
JP2021534319A	2021-12-09

ITOH, Tadashige et al. (JP)

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