Title:
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048122
Kind Code:
A1
Abstract:
This invention pertains to a substrate treatment technology for performing a prescribed substrate treatment on a substrate by supplying a treatment liquid to the substrate held by a rotating substrate holding unit, and collecting droplets of the treatment liquid flung out from the substrate during the substrate treatment. In this device, a cup-rinsing liquid is directly supplied to a rotary cup part from an inner portion of the rotary cup part while the rotary cup part rotates about the rotation axis. Accordingly, the treatment liquid is removed from the rotary cup part while the use amount of the cup-rinsing liquid is reduced, whereby the rotary cup part can be kept clean.
Inventors:
NEMOTO SHUHEI (JP)
Application Number:
PCT/JP2023/026933
Publication Date:
March 07, 2024
Filing Date:
July 24, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JPH08255789A | 1996-10-01 | |||
| JP2017162889A | 2017-09-14 | |||
| JP2021072415A | 2021-05-06 | |||
| JP2018147979A | 2018-09-20 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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