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Patent Searching and Data


Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/029900
Kind Code:
A1
Abstract:
A substrate treatment method including: a substrate holding step in which a substrate is held horizontally; a liquid film-formation step in which a treatment liquid is supplied to the upper surface of the substrate and a liquid film of the treatment liquid is formed that covers the upper surface of the substrate; a vapor atmosphere filling step in which a vapor atmosphere including vapor of a low surface tension liquid having a lower surface tension than the treatment liquid is filled around the liquid film of treatment liquid; a thin-film area formation step in which, in parallel with the vapor atmosphere filling step, a thin-film area is formed on the liquid film of treatment liquid by rotating the substrate at a prescribed thin-film area formation speed and partially removing the treatment liquid, without blowing gas on to the substrate; a thin-film area expansion step in which, in parallel with the vapor atmosphere filling step, the thin-film area is expanded towards the outer perimeter of the substrate; and a thin-film removal step in which, after the thin film is expanded over the entire upper surface in the thin-film area expansion step, the thin film is removed from the upper surface.

Inventors:
OTSUJI MASAYUKI (JP)
Application Number:
PCT/JP2016/069932
Publication Date:
February 23, 2017
Filing Date:
July 05, 2016
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
JP2004128495A2004-04-22
JPH11145099A1999-05-28
JP2008034455A2008-02-14
JP2007158270A2007-06-21
JP2008034612A2008-02-14
JP2009238793A2009-10-15
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
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