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Patent Searching and Data


Title:
SURFACE-ELASTIC FLOOR AND ASSEMBLY MODULE
Document Type and Number:
WIPO Patent Application WO/2012/017060
Kind Code:
A3
Abstract:
The invention relates to a surface-elastic floor comprising a floor element consisting of at least one floorboard connected by means of a profile, said floor element being connected to a load distribution layer applied to an elastic layer (54) or an oscillating carrier. The aim of the invention is to simplify the structure and the laying of said floor. To this end, at least one of the floorboards is connected to at least one load distribution element (20) of the load distribution layer to form pre-fabricated assembly modules (1,1') and the profile has a horizontal and vertical locking element at least along the longitudinal edges (16, 18), that is engaged with an adjacent floorboard or an adjacent assembly module (1,1') by being brought into a right angle and/or by means of an approximately pre-determinable movement. The assembly modules (1,1') are delivered to the building site as units pre-fabricated by the manufacturer.

Inventors:
HAMBERGER PETER (DE)
KUNER STEFAN (DE)
Application Number:
PCT/EP2011/063495
Publication Date:
June 21, 2012
Filing Date:
August 04, 2011
Export Citation:
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Assignee:
HAMBERGER INDUSTRIEWERKE GMBH (DE)
HAMBERGER PETER (DE)
KUNER STEFAN (DE)
International Classes:
E04F15/22; A63C19/00; E04F15/022
Domestic Patent References:
WO2010075839A12010-07-08
Foreign References:
DE102007036267A12009-02-19
US20060174974A12006-08-10
DE19962830A12001-07-12
US5906082A1999-05-25
DE19532606B42005-07-28
DE202009002023U12009-07-02
Attorney, Agent or Firm:
WINTER BRANDL FÜRNISS HÜBNER RÖSS KAISER POLTE - PARTNERSCHAFT (München, DE)
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