Title:
SURFACE MODIFICATION METHOD AND SURFACE MODIFICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/158361
Kind Code:
A1
Abstract:
This surface modification method modifies, by means of plasma of a treatment gas, a joining surface of a substrate at which the substrate joins to another substrate, the surface modification method including an adjustment step and a modification step. In the adjustment step, the water content in a treatment container that can accommodate the substrate is adjusted by supplying a humidified gas to the inside of the treatment container. In the modification step, the joining surface of the substrate is modified by generating plasma of the treatment gas in the treatment container in a state in which the water content inside the treatment container has been adjusted.
Inventors:
MIMURA YUJI (JP)
MAEDA HIROSHI (JP)
MASUZUMI TAKURO (JP)
TERADA TAKASHI (JP)
HONDA MASARU (JP)
SAKAMOTO RYOICHI (JP)
FUSE TAKASHI (JP)
KUBOTA YUSUKE (JP)
MAEDA HIROSHI (JP)
MASUZUMI TAKURO (JP)
TERADA TAKASHI (JP)
HONDA MASARU (JP)
SAKAMOTO RYOICHI (JP)
FUSE TAKASHI (JP)
KUBOTA YUSUKE (JP)
Application Number:
PCT/JP2022/000810
Publication Date:
July 28, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02
Domestic Patent References:
| WO2018084285A1 | 2018-05-11 |
Foreign References:
| JP2004193401A | 2004-07-08 | |||
| JP2006339363A | 2006-12-14 | |||
| JP2019186288A | 2019-10-24 | |||
| JP2011249643A | 2011-12-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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