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Patent Searching and Data


Title:
SURFACE-MODIFIER RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/190309
Kind Code:
A1
Abstract:
A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin composition, and a step in which the surface-modifier resin composition is thereafter removed from the surface to thereby modify the surface, the surface-modifier resin composition including a phenoxy resin.

Inventors:
KATAYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2023/012147
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08J7/12; C08K3/013; C08L63/00; C08L63/04; C08L71/10; C23C26/00
Foreign References:
JP2008255140A2008-10-23
JP2013028713A2013-02-07
JP2007211114A2007-08-23
JP2012214872A2012-11-08
JP2003020323A2003-01-24
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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