Title:
WIRING BOARD AND MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/190310
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure includes: an insulating layer; a conductor layer that includes a signal conductor, a ground conductor, and a power conductor; a plurality of via-hole conductors; and a via-hole conductor connection part. A portion of the signal conductor includes a first wiring group having a plurality of wirings extending to a region between a first connection part and a second connection part, and a second wiring group having a plurality of wirings extending to a region between the second connection part and a third connection part. The first wiring group includes a first portion extending from a region between the second connection part and a fifth connection part across a region between the fifth connection part and a sixth connection part, and a second portion extending to a region between a fourth connection part and the fifth connection part. The second wiring group has a third portion extending to a region between the fifth connection part and the sixth connection part, and a fourth portion extending to a region between the third connection part and the sixth connection part.
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Inventors:
KAWASE AKI (JP)
SHIROSHITA MAKOTO (JP)
SHIROSHITA MAKOTO (JP)
Application Number:
PCT/JP2023/012150
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/12; H05K3/46
Domestic Patent References:
| WO2010073832A1 | 2010-07-01 |
Foreign References:
| JP2011187683A | 2011-09-22 | |||
| JP2019079988A | 2019-05-23 | |||
| JP2002252298A | 2002-09-06 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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