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Title:
SURFACE-MOUNTED MODULE AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/064704
Kind Code:
A1
Abstract:
A surface-mounted module 2 is provided with: a plurality of two-dimensionally arrayed connection terminals 10; a module base 20 positioned on the plurality of connection terminals 10; and an electronic circuit 30 formed on the module base 20 and electrically connected to the plurality of connection terminals 10. The electronic circuit 30 is composed substantially of: one or more general-purpose semiconductors 31 comprising a discrete semiconductor, a standard logic semiconductor, or an application-specific standard product (ASSP) semiconductor; and one or more passive components 32 comprising a chip capacitor, a chip resistor, or a chip coil.

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Inventors:
TAMAKI TSUYOSHI (JP)
Application Number:
PCT/JP2020/036657
Publication Date:
March 31, 2022
Filing Date:
September 28, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L25/00; H05K1/18
Foreign References:
JP2019016770A2019-01-31
JP2019161214A2019-09-19
JP2003197849A2003-07-11
JP2018060899A2018-04-12
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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