Title:
SURFACE MOUNTER AND IMAGE ANALYZING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/166220
Kind Code:
A1
Abstract:
This surface mounter 1 for mounting a component E on a substrate P comprises: a rotary head 14 which supports a mounting head 21 for suctioning and retaining the component E to be raised and lowered; a head moving part 15 which moves the rotary head 14 in a direction parallel to the plate surface of the substrate P; a component measurement camera 71 which is provided on the rotary head 14, captures an image of the component E suctioned by the mounting head 21 to generate image data, and thins out and transmits the generated image data; and an analysis unit (an image capture board 84 and an arithmetic processing unit 81) which is connected to the component measurement camera 71 via a bending-resistant cable 110, and analyzes the thinned-out image data received from the component measurement camera 71. The component measurement camera 71 thins out the image data at a higher thinning rate in one direction (horizontal direction) that is set in accordance with the analysis content (measurement of the thickness of the component E) of the image data among the vertical direction and the horizontal direction of the image represented by the image data, than in the other direction (vertical direction), or thins out the image data in one direction while not thinning out the image data in the other direction.
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Inventors:
TAKAMA KAZUSHI (JP)
Application Number:
PCT/JP2020/007042
Publication Date:
August 26, 2021
Filing Date:
February 21, 2020
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/08
Domestic Patent References:
| WO2015019487A1 | 2015-02-12 |
Foreign References:
| JP2019110257A | 2019-07-04 | |||
| JP2010232295A | 2010-10-14 | |||
| JP2014090076A | 2014-05-15 | |||
| JP2003273589A | 2003-09-26 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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