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Patent Searching and Data


Title:
SURFACE PRESSURE ANALYSIS DEVICE, METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/235364
Kind Code:
A1
Abstract:
Provided is a surface pressure analysis device, method, and program with which it is possible to automatically evaluate a surface pressure applied to an inspection surface of an object to be measured, and to assist an inspector who makes a pass/fail determination or the like for the object to be measured. An image acquisition unit (210A) of a server functioning as a surface pressure analysis device acquires an inspection image (10) from a user terminal. The inspection image (10) is a captured image of a pressure measurement sheet that is placed on an inspection surface of an object to be measured and that has developed colors with a density distribution corresponding to the strengths of pressure applied to the inspection surface. A conversion unit (222) converts concentration values of the inspection image (10) into two-dimensionally distributed first pressure values. An evaluation information generation process unit (224) compares the first pressure values against a limit sample retrieved from a memory (240), and generates information (evaluation information) indicating the degree of match therebetween as a primary determination result. The primary determination result is outputted (transmitted) from an output unit (210B) to the user terminal and displayed on a display of the user terminal.

Inventors:
SASAHARA KENJI (JP)
UEKI SHOTA (JP)
NIWA HIROYUKI (JP)
OMOTO MAKOTO (JP)
Application Number:
PCT/JP2021/018481
Publication Date:
November 25, 2021
Filing Date:
May 14, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G01L5/00; G01L1/00
Foreign References:
JP2009128248A2009-06-11
JP2020018365A2020-02-06
JP2016024534A2016-02-08
JP3177347U2012-08-02
US20080289438A12008-11-27
JP2000321152A2000-11-24
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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