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Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/281777
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sk rate of change, represented by formula (1) below, of 23.0-45.0%. Formula (1): Sk rate of change = (P2-P1)/P2×100 In the formula, P1 is Sk calculated by applying a λs filter having a cutoff value λs of 2 µm, and P2 is Sk calculated without applying the λs filter.

Inventors:
MATSUOKA YUKI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2022/001220
Publication Date:
January 12, 2023
Filing Date:
January 14, 2022
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; C25D5/16; H05K1/03; H05K1/09
Domestic Patent References:
WO2021117339A12021-06-17
WO2017006739A12017-01-12
WO2020196265A12020-10-01
WO2011138876A12011-11-10
WO2010061736A12010-06-03
Foreign References:
JP2014152352A2014-08-25
JP2017036495A2017-02-16
JP2020128589A2020-08-27
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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