Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/281778
Kind Code:
A1
Abstract:
This surface-treated copper foil comprises a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of change in Sk given by formula (1) for the surface-treatment layer is 0.180-0.600 µm. (1): Amount of change in Sk = P2 - P1
In the formula, P1 is the Sk calculated using a λs filter for which the cut off value λs is 2 µm, and P2 is the Sk calculated without using this λs filter.
Inventors:
MATSUOKA YUKI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2022/001221
Publication Date:
January 12, 2023
Filing Date:
January 14, 2022
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; C25D5/16
Domestic Patent References:
| WO2021117339A1 | 2021-06-17 | |||
| WO2017006739A1 | 2017-01-12 | |||
| WO2020196265A1 | 2020-10-01 | |||
| WO2011138876A1 | 2011-11-10 | |||
| WO2010061736A1 | 2010-06-03 |
Foreign References:
| JP2014152352A | 2014-08-25 | |||
| JP2017036495A | 2017-02-16 | |||
| JP2020128589A | 2020-08-27 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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