Title:
SURFACE-TREATED COPPER FOIL, AND COPPER-CLADDED LAMINATE AND PRINTED WIRING BOARD EACH USING SAID SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2022/215330
Kind Code:
A1
Abstract:
[Problem] The present invention provides a surface-treated copper foil which exhibits high adhesion even to a low dielectric resin base material since the treated surface thereof has a three-dimensional shape that is formed of a plurality of linked fine copper particles and has a high specific surface area ratio per 1 m2 of the two-dimensional area, thereby exhibiting high anchoring effect, and which is not susceptible to separation from an insulating resin base material even if exposed to high temperatures for a long period of time, while having excellent transmission characteristics that are equivalent to the transmission characteristics of a non-roughened copper foil. This surface-treated copper foil is suitable for use as a printed wiring board for high frequency signal transmission, the printed wiring board being capable of forming a multilayer printed wiring board having excellent interlayer adhesion. [Solution] A surface-treated copper foil which is obtained by arranging, on at least one surface of an untreated copper foil, a finely roughened layer that is composed of copper particles that have a primary particle diameter of 10 nm to 110 nm, and a heat resistance treatment layer that contains nickel and phosphorus, wherein: the surface area ratio of the treated surface per 1 m2 of the two-dimensional area as calculated from the specific surface area that is determined by a krypton gas adsorption BET method is 5.1 or more; and the adhesion amount of the nickel per 1 m2 of the surface area is 2 mg or more.
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Inventors:
OKAMOTO TAKESHI (JP)
MIYAMOTO KENTA (JP)
MIYAMOTO KENTA (JP)
Application Number:
PCT/JP2022/003721
Publication Date:
October 13, 2022
Filing Date:
February 01, 2022
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD (JP)
International Classes:
C23C28/00; C25D5/12; C25D5/16; C25D7/06; H05K1/03
Domestic Patent References:
| WO2020031721A1 | 2020-02-13 | |||
| WO2017138338A1 | 2017-08-17 |
Foreign References:
| JP2015061935A | 2015-04-02 | |||
| JP2015061756A | 2015-04-02 | |||
| JP2017172048A | 2017-09-28 | |||
| JP2016146477A | 2016-08-12 | |||
| JP2015042779A | 2015-03-05 |
Attorney, Agent or Firm:
MAEKAWA Makiko et al. (JP)
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