SURFACE-TREATED COPPER FOIL AND FLEXIBLE COPPER-CLAD LAMINATE PLATE AND FILM CARRIER TAPE MANUFACTURED BY USE OF THE SURFACE-TREATED COPPER FOIL

Title:

SURFACE-TREATED COPPER FOIL AND FLEXIBLE COPPER-CLAD LAMINATE PLATE AND FILM CARRIER TAPE MANUFACTURED BY USE OF THE SURFACE-TREATED COPPER FOIL

Document Type and Number:

WIPO Patent Application WO/2005/120139

Kind Code:

A1

Abstract:

A surface-treated electrolytic copper foil for a polyimide resin substrate, which is an electrolytic copper foil having a surface treating layer for improving the adhesiveness with the polyimide resin substrate on the glossy surface side thereof, characterized in that the surface treating layer comprises 65 to 90 wt % of nickel or cobalt and 10 to 35 wt % of zinc, relative to the total weight of the layer except the inevitable impurities, and is a nickel-zinc alloy layer or a cobalt-zinc alloy layer having a weight thickness of 30 to 70 mg/m²; and the like. The above surface-treated electrolytic copper foil can secure the adhesiveness being substantially satisfactory in a practical use, when used in the lamination of unroughened copper foil with a polyimide resin substrate and thus can provide a surface-treated electrolytic copper foil preventing a tin plating from creeping in between them.

More Like This:

JPH069866

[Title of the Invention] Anticorrosion method for steel materials

Inventors:

OKADA KAZUYUKI (JP)
TAKAHASHI MASARU (JP)

Application Number:

PCT/JP2005/010151

Publication Date:

December 15, 2005

Filing Date:

June 02, 2005

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO (JP)
OKADA KAZUYUKI (JP)
TAKAHASHI MASARU (JP)

International Classes:

B32B15/08; B32B15/088; B32B15/20; C23C28/00; C23C30/00; H05K1/09; C25D7/06; H01L21/60; H01L23/498; H05K3/38; H05K1/03; (IPC1-7): H05K1/09; H05K3/38; C25D7/06; C23C28/00; H01L21/60

Foreign References:

JPS61110794A	1986-05-29
JPH11354901A	1999-12-24
JPH1018075A	1998-01-20
JPH05140765A	1993-06-08
JPH10146915A	1998-06-02
JP2000141542A	2000-05-23
JP2004131836A	2004-04-30
JPH0331496A	1991-02-12
JP2001177204A	2001-06-29

Attorney, Agent or Firm:

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)

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