Title:
SURFACE-TREATED COPPER FOIL HAVING ENHANCED VISIBILITY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/004151
Kind Code:
A1
Abstract:
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same, wherein a surface of a copper foil is subjected to a micro-roughening treatment to achieve a surface-roughening treatment, which allows the copper foil to have excellent heat resistance and chemical resistance, so as to achieve a film having a high light transmissivity, an excellent etching property, and an improved visibility. According to the present invention, a copper foil can be surface-roughened to have excellent heat resistance and chemical resistance by performing micro-roughening treatment on a shiny surface of the copper foil. Further, according to the present invention, by performing micro-roughening treatment on a shiny surface of a copper foil, it is possible to obtain a surface-treated copper foil for a microcircuit board, which improves E/R of a circuit by circuit etching and allows resin to have excellent light transmissivity after etching.
Inventors:
BEOM WON JIN (KR)
CHOI EUN SIL (KR)
KIM HYUNG CHEOL (KR)
SONG KI DEOK (KR)
CHOI EUN SIL (KR)
KIM HYUNG CHEOL (KR)
SONG KI DEOK (KR)
Application Number:
PCT/KR2017/006094
Publication Date:
January 04, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
ILJIN MAT CO LTD (KR)
International Classes:
C25D5/16; C23C22/53; C23C28/00; C25D1/04; C25D3/22; C25D5/48; C25D7/06; H05K1/09; H05K3/02
Foreign References:
| KR101129471B1 | 2012-04-02 | |||
| JP2002069691A | 2002-03-08 | |||
| JPH06169169A | 1994-06-14 | |||
| KR20130131379A | 2013-12-03 | |||
| JP2005008955A | 2005-01-13 |
Attorney, Agent or Firm:
CHOI, Hoon Sik (KR)
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