Title:
SURFACE TREATMENT FLUID, COPPER SURFACE TREATMENT METHOD, COPPER-TIN JOINING METHOD, AND JOINED BODY PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/014254
Kind Code:
A1
Abstract:
A surface treatment fluid according to the present invention is an aqueous solution comprising: a water-soluble copper salt; a thio compound that has a structure in which at least one nitrogen atom and at least one sulfur atom are covalently bonded to one carbon atom; and at least one nitrogen-containing basic compound selected from a basic amino acid, a guanidine compound, and a quaternary ammonium salt. In the surface treatment fluid, the water-soluble copper salt concentration is preferably 0.05-70 mM and the thio compound concentration is preferably 0.005-20 mM. Bringing the surface treatment fluid into contact with the surface of copper makes it possible to improve the joining performance of tin.
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Inventors:
NEGISHI RYO (JP)
SAITO SATOSHI (JP)
TOMATSU ITSURO (JP)
SAITO SATOSHI (JP)
TOMATSU ITSURO (JP)
Application Number:
PCT/JP2023/023148
Publication Date:
January 18, 2024
Filing Date:
June 22, 2023
Export Citation:
Assignee:
MEC CO LTD (JP)
International Classes:
C23C26/00; C23C28/00
Foreign References:
| US4311551A | 1982-01-19 | |||
| US6063172A | 2000-05-16 | |||
| CN107604360A | 2018-01-19 | |||
| JP2017133099A | 2017-08-03 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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