Title:
SWITCH IC, HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/088410
Kind Code:
A1
Abstract:
According to the present invention, an RF module (1) is provided with: a switch IC (50A) that is formed on the surface of a module substrate (100); and a passive circuit (30) that is formed on the module substrate (100). The switch IC (50A) is provided with a high frequency circuit (20A) that is formed on an IC substrate; and a digital control circuit (10). If the IC substrate is viewed in plan, the digital control circuit (10) is surrounded by the high frequency circuit (20A). The high frequency circuit (20A) has a plurality of analog ground electrodes (62); and the plurality of analog ground electrodes (62) are arranged within the high frequency circuit (20A) at the boundary with the digital control circuit (10) so as to surround the digital control circuit (10) when viewed in plane.
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Inventors:
NANIWA YUSUKE (JP)
MUTO HIDEKI (JP)
MUTO HIDEKI (JP)
Application Number:
PCT/JP2017/040183
Publication Date:
May 17, 2018
Filing Date:
November 08, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/10; H04B1/00; H04B1/38
Domestic Patent References:
| WO2012128271A1 | 2012-09-27 | |||
| WO2010053131A1 | 2010-05-14 |
Foreign References:
| JP2007266840A | 2007-10-11 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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