Title:
TAPE STICKING DEVICE, RESIN MOLDING SYSTEM, TAPE STICKING METHOD, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/127207
Kind Code:
A1
Abstract:
This tape sticking device comprises: a tape holding mechanism (21); a bend mechanism (23) positioned so as to be spaced apart from the tape holding mechanism (21); and a movement mechanism configured so as to be capable of moving the tape holding mechanism (21) and the bend mechanism (23) relative to each other. The bend mechanism (23) comprises an elastic member holding mechanism (22) configured so as to be capable of holding at least a portion of the outer periphery of an elastic member (32). The bend mechanism (23) is configured such that the elastic member (32), when in a state of being held by the elastic member holding mechanism (22), can be bent so as to protrude toward the tape holding mechanism (21) side.
Inventors:
KITA IPPEI (JP)
Application Number:
PCT/JP2022/034772
Publication Date:
July 06, 2023
Filing Date:
September 16, 2022
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
H01L21/56; B29C43/18; H01L21/683; H01L23/50
Foreign References:
| JP2019106493A | 2019-06-27 | |||
| JP2006196605A | 2006-07-27 | |||
| JP2012238689A | 2012-12-06 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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