Title:
TEMPERATURE ADJUSTMENT SYSTEM AND PLASMA PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/048366
Kind Code:
A1
Abstract:
Disclosed is a temperature adjustment system which comprises a first segment, a second segment, and a connection unit. The first segment includes: a first temperature adjustment circuit including a first heat exchanger configured to perform heat exchange with a first temperature adjustment medium; and a first case for accommodating therein the first temperature adjustment circuit. The second segment includes: a first tank and a first pump in a first circulation system configured to circulate the first temperature adjustment medium through a first flow path in a first member of a plasma processing device; and a second case for accommodating therein the first tank and the first pump. The connection unit constitutes a part of the first circulation system, is disposed between the first segment and the second segment, and is connected between the first pump and the first heat exchanger.
Inventors:
SAKAI HAYATO (JP)
CHIBA KAZUHIRO (JP)
CHIBA KAZUHIRO (JP)
Application Number:
PCT/JP2023/030155
Publication Date:
March 07, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46
Foreign References:
| JP2020190494A | 2020-11-26 | |||
| JP2016081158A | 2016-05-16 | |||
| JP2014127534A | 2014-07-07 | |||
| JPH06346256A | 1994-12-20 | |||
| JP2006269944A | 2006-10-05 | |||
| JP2005175460A | 2005-06-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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