TERMINAL PROTECTING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE FURNISHED WITH ELECTROMAGNETIC-WAVE BLOCKING FILM

Title:

TERMINAL PROTECTING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE FURNISHED WITH ELECTROMAGNETIC-WAVE BLOCKING FILM

Document Type and Number:

WIPO Patent Application WO/2020/032175

Kind Code:

A1

Abstract:

The present invention relates to a terminal protecting tape (1) used in a step for forming an electromagnetic-wave blocking film on a terminal-attached semiconductor device. The terminal protecting tape (1) has a viscoelastic layer (12). In a dynamic viscoelasticity measurement of the viscoelastic layer (12), the value of tanδ at 50°C is 0.2 or more, and the thickness of the viscoelastic layer (12) is 80-800 μm.

Inventors:

BANDOU SAYAKA (JP)
SATO AKINORI (JP)
NAKAISHI YASUNOBU (JP)
OKAMOTO NAOYA (JP)

Application Number:

PCT/JP2019/031370

Publication Date:

February 13, 2020

Filing Date:

August 08, 2019

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

H01L23/00; B32B7/022; B32B27/00; C09J7/38; H01L21/301; H01L21/56; H01L23/28

Domestic Patent References:

WO2016121488A1

2016-08-04

Foreign References:

JP2014183181A	2014-09-29
JP2016192488A	2016-11-10
JP2017165880A	2017-09-21

Attorney, Agent or Firm:

NISHIZAWA Kazuyoshi et al. (JP)

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