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Patent Searching and Data


Title:
TERMINALIZED WIRE
Document Type and Number:
WIPO Patent Application WO/2014/181698
Kind Code:
A1
Abstract:
This terminalized wire (1) comprises a flattened round terminal (5) that has a through-hole (5a) in the middle thereof and is integrally formed at the tip of a core wire (3) via resistance welding performed by running current between electrodes between which a tip section of the core wire (3) has been crimped, said tip section having been folded over so as to form a ring. When forming said round terminal (5), a ring-shaped boss (5b) is formed on the bottom surface thereof so as to protrude perpendicularly from the edge of the through-hole (5a). To mount and affix the round terminal (5) to an object (9), the aforementioned boss (5b) is inserted into a mounting hole (9a) in said object (9), constraining movement of the round terminal (5) relative to the object (9) in the radial direction of the through-hole (5a).

Inventors:
IIZUKA HAYATO (JP)
KODA YOSHITAKA (JP)
TSUGE SYUNYA (JP)
Application Number:
PCT/JP2014/061559
Publication Date:
November 13, 2014
Filing Date:
April 24, 2014
Export Citation:
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Assignee:
YAZAKI CORP (JP)
International Classes:
H01R11/11; H01B7/00; H01R11/12; H02G1/14
Foreign References:
JPS6446974U1989-03-23
JPH04249875A1992-09-04
JP2002136019A2002-05-10
JP2005158580A2005-06-16
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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