Title:
THERMAL CONDUCTIVITY REGULATING AGENT AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/181580
Kind Code:
A1
Abstract:
The present invention provides: a thermal conductivity regulating agent in the form of hollow particles, the thermal conductivity regulating agent being capable of decreasing the thermal conductivity of a molded body that uses a varnish as a starting material, and the like; and a molded body which contains this thermal conductivity regulating agent and has a decreased thermal conductivity. A thermal conductivity regulating agent that is in the form of hollow particles, each of which comprises a shell containing a resin and a hollow part surrounded by the shell, wherein: the shell contains, as the resin, a polymer that contains 80 parts by mass or more of a crosslinkable monomer unit in 100 parts by mass of all the monomer units; and with respect to an immersion test of the thermal conductivity regulating agent, in which 0.1 mg of the thermal conductivity regulating agent is added to 4 mL of acetone in an environment of 25°C, shaken for 10 minutes at a shaking speed of 100 rpm, and subsequently left at rest for 48 hours, the amount of the thermal conductivity regulating agent that settled out in the acetone is less than 5% by mass.
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Inventors:
KUROKAWA HISASHI (JP)
Application Number:
PCT/JP2022/007122
Publication Date:
September 01, 2022
Filing Date:
February 22, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F220/20; B01J13/18
Domestic Patent References:
| WO2019177013A1 | 2019-09-19 | |||
| WO2019177006A1 | 2019-09-19 | |||
| WO2017163439A1 | 2017-09-28 | |||
| WO2019188996A1 | 2019-10-03 | |||
| WO2019188996A1 | 2019-10-03 |
Foreign References:
| JP2010222492A | 2010-10-07 | |||
| JP2021054941A | 2021-04-08 | |||
| JP2017066351A | 2017-04-06 |
Other References:
KAGAKU BINRANKISO HEN: "Kaitei 4 Ban", 30 September 1993, MARUZEN PUBLISHING CO., LTD., pages: II-498,II-503
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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