Title:
THERMAL DEVICE COOLING HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2023/276940
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat sink: which is used for cooling a thermal device formed from a semiconductor or the like; and which is suitable for cooling the thermal device formed from a semiconductor or the like and is used particularly for a compact module and the like. The above problem is solved by a thermal device cooling heat sink characterized by having: a flat-shaped heat pipe, a thermal device provided on the heat pipe; and heat dissipation fins each provided on the heat pipe and at a position spaced apart from the thermal device.
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Inventors:
PARK OKDAN (JP)
ANZAI EIJI (JP)
ANZAI EIJI (JP)
Application Number:
PCT/JP2022/025545
Publication Date:
January 05, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD (JP)
NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD (JP)
International Classes:
H01L23/427; F28D15/02; H01L23/473
Domestic Patent References:
| WO2020230499A1 | 2020-11-19 | |||
| WO2014088044A1 | 2014-06-12 |
Foreign References:
| JP2010267435A | 2010-11-25 | |||
| JP2009302417A | 2009-12-24 | |||
| JPH0536897U | 1993-05-18 | |||
| JPH08105698A | 1996-04-23 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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