Title:
THERMAL DEVICE HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2023/276939
Kind Code:
A1
Abstract:
The present invention provides a heat sink that has greater cooling effects and a simpler structure. According to the present invention, a thermal device heat sink comprises a metal cylindrical member, a heat-radiating fin, and a metal hollow member or heat pipe that has an internal fluid passage. The thermal device heat sink is designed such that the heat-radiating fin is provided to an outer circumferential part of the metal cylindrical member, the metal hollow member or heat pipe is arranged inside the metal cylindrical member, and both an inner circumferential surface of the metal cylindrical member and an outer circumferential surface of the metal hollow member or heat pipe contact a thermal device.
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Inventors:
PARK OKDAN (JP)
ANZAI EIJI (JP)
ANZAI EIJI (JP)
Application Number:
PCT/JP2022/025544
Publication Date:
January 05, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD (JP)
NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD (JP)
International Classes:
H01L23/427; F28D15/02; H01L23/473
Foreign References:
| JP2001298133A | 2001-10-26 | |||
| JP2020085426A | 2020-06-04 | |||
| JP2012239256A | 2012-12-06 | |||
| JP2016103549A | 2016-06-02 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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