Title:
THERMAL PRINT HEAD, THERMAL PRINTER, AND THERMAL PRINT HEAD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/014228
Kind Code:
A1
Abstract:
This thermal print head comprises a substrate, a resistor layer, and a wiring layer. The substrate has a main surface and a rear surface. The resistor layer includes a plurality of heat generating parts that are supported on the substrate and arranged in a main scanning direction. The wiring layer is conductive with the plurality of heat generating parts. The wiring layer includes a plurality of individual wires and a common wire. The substrate has a recess positioned on one side in a sub-scanning direction relative to the plurality of heat generating parts. The recess is positioned between the main surface and the rear surface in a thickness direction. The thermal print head further comprises a conductive layer that includes a portion accommodated in the recess as viewed in the main scanning direction, and that is conductive with the common wire.
Inventors:
KIMOTO SATOSHI (JP)
FUJITA AKIRA (JP)
NAKATANI GORO (JP)
FUJITA AKIRA (JP)
NAKATANI GORO (JP)
Application Number:
PCT/JP2023/022308
Publication Date:
January 18, 2024
Filing Date:
June 15, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
B41J2/345; B41J2/335
Foreign References:
| JP2022090328A | 2022-06-17 | |||
| JPH05330110A | 1993-12-14 | |||
| JPH10250127A | 1998-09-22 | |||
| JPH0852890A | 1996-02-27 | |||
| JPH0858126A | 1996-03-05 | |||
| JPH0858129A | 1996-03-05 | |||
| JP2016101719A | 2016-06-02 | |||
| JPH04179555A | 1992-06-26 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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