Title:
THERMAL SHOCK TESTING DEVICE AND THERMAL SHOCK TESTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/209865
Kind Code:
A1
Abstract:
A thermal shock testing device (10) comprises: a sample chamber (4) in which a sample (11) to be evaluated is placed and sealed; a chiller (2) that cools the sample chamber (4) to a prescribed temperature by using a coolant (5); a lamp heater (6) that heats the sample (11) to be evaluated to a target temperature; a temperature sensor (7) that detects the temperature of the sample (11) to be evaluated; and a control device (1) that controls operation of the chiller (2) and the energization/shut-off of the lamp heater (6). After the sample chamber (4) is cooled to the prescribed temperature, the sample (11) to be evaluated is heated to the target temperature by using the lamp heater (6), then energization of the lamp heater (6) is shut off, and a thermal shock is applied to the sample (11) to be evaluated, thereby making it possible to perform a thermal shock test in a short time.
Inventors:
YAMAZAKI KOJI (JP)
Application Number:
PCT/JP2022/019075
Publication Date:
November 02, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01N3/60
Foreign References:
| JPH07270303A | 1995-10-20 | |||
| JPH04122352U | 1992-11-02 | |||
| JPH0584846U | 1993-11-16 | |||
| JP2014145669A | 2014-08-14 | |||
| JP2018063247A | 2018-04-19 | |||
| JP2016024071A | 2016-02-08 | |||
| KR20090109597A | 2009-10-21 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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